PCB board number of layers: 10 layers; PCB board maximum size: 330mmx240mm;
CHIP material component placement minimum size: 0.6mmx0.3mm, maximum size: 12mmx12mmx5mm;
QFP, SOP type component mounting maximum size: 30mmx30mm, minimum pitch between feet: 0.5mm
BGA component mounting maximum size: 35mmx35mm, minimum ball diameter: 0.35mm, minimum ball spacing: 0.5mm
Automatic plate feeder: applied to the front end of the welding line, automatically feeding the welded plate into the production line.
Temporary storage machine: Before application to AOI, according to the timeliness of AOI testing, the reflow soldered board is automatically sent to the AOI inspection or income spare box to improve the production efficiency of the production line.
OK/NG board machine: After being applied to AOI, according to the AOI test result, the NG board and the OK board are automatically framed separately, without manual boarding.